产品品牌美国陶氏
产品产地
产品型号DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler
包装规格
陶氏DOW硅橡胶DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler
一种柔软且可压缩的材料,一旦固化,设计用于将安装在印刷电路板上的PCB模块组件的热量散发到散热器,为发动机或变速器控制单元等模块提供可靠的冷却解决方案。A soft and compressible material once cured, designed to dissipate the heat from PCB module assemblies mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit.
陶氏DOWDOWSIL™TC-4535 CV导热间隙填充物参数
颜色 - A部分:白色
密度:3.1克/ cc
介电常数1MHz:6.5 / 5E-3
保质期:180天[123 ]
导热系数:3.5瓦/米K触变指数:3.6
粘度 - A部分:200 Pa.s
粘度 - B部分:230 Pa .s
体积电阻率:3E + 13欧姆 - 厘米
工作时间25摄氏度:60分钟
两部分:√
Color - Part A:White
Density:3.1 grams per cc
Dielectric Constant at 1MHz:6.5/5E-3
Shelf Life:180 Days
Thermal Conductivity:3.5 Watts per meter K
Thixotropic Index:3.6
Viscosity - Part A:200 Pa.s
Viscosity - Part B:230 Pa.s
Volume Resistivity:3E+13 ohm-centimeters
Working Time in hrs at 25 Deg C:60 minutes
Two-Part:√