陶氏DOW硅橡胶DOWSIL™ EG-3896 Kit

Suitable for potting and protecting of electronics devices, especially power semiconductor modules to protect dies and interconnects from environmental conditions and to provide dielectric insulation.

陶氏DOWDOWSIL™EG-3896套件参数

100 kHz时的介电常数：2.9

1MHz时的介电常数：2.9

介电强度：559伏/ mil / mil

介电强度（kV / mm） ：22 kV / mm

耗散因数在100 kHz：4.6e-005

凝胶硬度：220克/渗透（1

热固化：30分钟@ 70度C，10分钟@ 100摄氏度，5分钟@ 150摄氏度

混合粘度：520厘泊

温度范围：-40至185摄氏度

体积电阻率： 2e + 015 ohm-centimeters

工作时间：＆gt; 240分钟

两部分：√

Dielectric Constant at 100 kHz:2.9

Dielectric Constant at 1MHz:2.9

Dielectric Strength:559 volts per milv/mil

Dielectric Strength (kV/mm):22 kV/mm

Dissipation Factor at 100 kHz:4.6e-005

Gel Hardness:220 Grams/Penetration (1

Heat Cure:30 Minutes @ 70 Deg C,10 Minutes @ 100 Deg C,5 Minutes @ 150 Deg C

Mixing Viscosity:520 Centipoise

Temperature Range:-40 to 185 Deg C

Volume Resistivity:2e+015 ohm-centimeters

Working Time:> 240 Minutes

Two-Part:√