陶氏DOW有机硅胶粘剂DOWSIL™ EG-4000 Kit

高温和低温稳定性凝胶，适用于连续模式中-60℃至+ 200℃的操作温度，并且>在215℃下3000小时。软凝胶，适用于高要求的应力释放应用。

新型DOWSIL™EG-4000电介质凝胶可在高工作温度下提供经济高效的保护，以支持下一代PCB模块。 DOWSIL™EG-4000是4XXX产品系列中的一种柔软介电凝胶，有助于满足不断变化的市场需求，通过提高功率密度来保护紧凑型元件。

虽然其他产品可能在高温下降解，但DOWSIL™EG-4000即使在215°C的空气烘箱中加速老化长达2000小时，也能提供耐热性和附着力。

DOWSIL™EG-4000展示：

电气和机械性能的稳定性

无表面开裂

无外壳脱层

低粘度热固化

DOWSIL™EG-4000的特性使其适用于各种应用，例如：

用于电源转换的IGBT模块的灌封

工业传感器和执行器，绝缘高压设备

保护PCB和敏感设备在高温下运行

High and low temperature stability gel, suitable for operating temperature ranging from -60℃ to + 200℃ in continuous mode and > 3,000 hours at 215℃. Soft gel for highly demanding stress-release applications.

The new DOWSIL™ EG-4000 Dielectric Gel provides cost-effective protection at high operating temperatures to support next-generation PCB modules. DOWSIL™ EG-4000 is a soft Dielectric Gel within the 4XXX product family that is helping answer evolving market needs for protection of compact components with increasing power densities.

While other products may degrade at high temperatures, DOWSIL™ EG-4000 provides heat resistance and adhesion even when exposed to accelerated aging at 215° C in an air oven for up to 2000 hours.

DOWSIL™ EG-4000 exhibits:

• Stability of electrical and mechanical properties
• No surface cracking
• No delamination from housing
• Heat cure with low viscosity

The properties fo DOWSIL™ EG-4000 make it suitable for various applications such as:

• The potting of IGBT modules used for power conversion
• Industrial sensors and actuators, insulation of high voltage devices
• Protection of PCB and sensitive devices operated at high temperatures 

陶氏DOWDOWSIL™EG-4000套件参数