陶氏DOW有机硅胶粘剂SYLGARD™ 535 Thixotropic Dielectric Gel

单组分，透明，热固化，触变凝胶。

One-part, clear, heat cure, thixotropic gel.

陶氏DOWSYLGARD™535触变性电介质凝胶参数

颜色：半透明

凝胶硬度：85克/渗透（1

热固化：60分钟@ 150摄氏度

不可流动性：√

[123 ]粘度：2925 mPa.s

体积电阻率：6e + 014 ohm-centimeters

耐水性：√

高温稳定性：√

低温度稳定：√

单部分：√

耐臭氧性：√

软凝胶：√

软应力消除：√

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热阻：√

热固性：√

触变性：√

抗紫外线：√

耐水性：√

Color:Translucent

Gel Hardness:85 Grams/Penetration (1

Heat Cure:60 Minutes @ 150 Deg C

Nonflowable:√

Viscosity:2925 mPa.s

Volume Resistivity:6e+014 ohm-centimeters

Water Resistant:√

High Temperature Stable:√

Low Temperature Stable:√

One-Part:√

Ozone Resistance:√

Soft Gel:√

Soft Stress Relieving:√

Thermal Resistance:√

Thermosetting:√

Thixotropic:√

UV Resistance:√

Water Resistance:√