陶氏DOW有机硅树脂DOWSIL™ SC 102 Compound

白色，非固化和不流动的导热化合物。旨在为计算机，电源和汽车应用中使用的电子模块的冷却提供有效的热传递。

A white, non-curing and non-flowing, thermally conductive compound. Designed to provide efficient thermal transfer for the cooling of electronic modules used in computer, power supply, and automotive applications.

陶氏DOWDOWSIL™SC 102化合物参数

颜色：白色

介电强度：50伏特/ milv / mil

介电强度（kV / mm）：2 kV / mm

可流动性：√[123 ]

疏水性：√

不挥发物含量：99.7％

导热系数：0.9瓦/米K

体积电阻率：2e + 016欧姆 - 厘米

耐水性：√

对铝的附着力：√

对陶瓷的附着力：√

对FR4的附着力：√

对金属的附着力： √

对塑料的附着力：√

陶瓷：√

高温稳定：√

低气味：√

低温稳定：√

单部分：√

抗氧化性：√

耐臭氧性：√

塑料：√

聚酯：√

无底漆附着力：√

耐溶剂性：√

热阻：√

抗紫外线：√

耐水性：√

Color:White

Dielectric Strength:50 volts per milv/mil

Dielectric Strength (kV/mm):2 kV/mm

Flowable:√

Hydrophobic:√

Nonvolatile Content:99.7 %

Thermal Conductivity:0.9 Watts per meter K

Volume Resistivity:2e+016 ohm-centimeters

Water Resistant:√

Adhesion to Aluminum:√

Adhesion to Ceramic:√

Adhesion to FR4:√

Adhesion to Metal:√

Adhesion to Plastic:√

Ceramics:√

High Temperature Stable:√

Low Odor:√

Low Temperature Stable:√

One-Part:√

Oxidation Resistance:√

Ozone Resistance:√

Plastics:√

Polyesters:√

rless Adhesion:√

Solvent Resistance:√

Thermal Resistance:√

UV Resistance:√

Water Resistance:√