陶氏DOW有机硅胶粘剂DOWSIL™ SE 4486 Thermally Conductive Adhesive

旨在为电子模块（包括家用电器设备）的冷却提供有效的热传递。它是一种单组分，白色，湿固化RTV，高流动性，快速无粘性，高导热粘合剂，具有可控的挥发性。

Designed to provide efficient thermal transfer for the cooling of electronic modules, including home appliance devices. It is a one-part, white, moisture cure RTV, highly flowable, fast tack-free, high thermally conductive adhesive with controlled volatility.

陶氏DOWDOWSIL™SE 4486导热胶参数

1MHz时的介电常数：4.8

介电强度：500伏/密耳

硬度计 - 肖氏A：81肖氏A

动态粘度：19600厘泊[

伸长率：43％

室温固化 - 小时：168小时

剪切：240 psi

比重@ 25C：2.6

[123 ]温度范围：-45至200摄氏度

抗拉强度：570 psi

导热系数：1.6瓦/米K

体积电阻率：2e + 014欧姆 - 厘米

对陶瓷的附着力：√

对金属的附着力：√

对塑料的附着力：√

陶瓷：√

部分：√

耐臭氧性：√

塑料：√

抗紫外线：√

Dielectric Constant at 1MHz:4.8

Dielectric Strength:500 volts per milv/mil

Durometer - Shore A:81 Shore A

Dynamic Viscosity:19600 Centipoise

Elongation:43 %

Room Temperature Cure - Hours:168 Hours

Shear:240 psi

Specific Gravity @ 25C:2.6

Temperature Range:-45 to 200 Deg C

Tensile Strength:570 psi

Thermal Conductivity:1.6 Watts per meter K

Volume Resistivity:2e+014 ohm-centimeters

Adhesion to Ceramic:√

Adhesion to Metal:√

Adhesion to Plastic:√

Ceramics:√

One-Part:√

Ozone Resistance:√

Plastics:√

UV Resistance:√